V3 changes:
Add debug messages for new return path when successfully erase the
specified blocks. Refine logic for calculating the size for writing
zeros to device.
V2 changes:
The Trim command is not supported on all eMMC devices. For those devices
that do not support such command, add codes to handle the scenario.
Commit message:
The current implementation of the Erase Block Protocol service
EraseBlocks() uses the erase command. According to spec eMMC Electrical
Standard 5.1, Section 6.6.9:
The erasable unit of the eMMC is the "Erase Group"; Erase group is
measured in write blocks that are the basic writable units of the Device.
...
When the Erase is executed it will apply to all write blocks within an
erase group.
However, code logic in function EmmcEraseBlocks() does not check whether
the blocks to be erased form complete erase groups. Missing such checks
will lead to erasing extra data on the device.
This commit will:
a. If the device support the Trim command, use the Trim command to
perform the erase operations for eMMC devices.
According to the spec:
Unlike the Erase command, the Trim function applies the erase operation to
write blocks instead of erase groups.
b. If the device does not support the Trim command, use the Erase command
to erase the data in the erase groups. And write zeros to those blocks
that cannot form a complete erase group.
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Hao Wu <hao.a.wu@intel.com>
Reviewed-by: Star Zeng <star.zeng@intel.com>
Adds the implementation of Disk Information Protocol for EMMC devices per
PI 1.6 spec.
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Hao Wu <hao.a.wu@intel.com>
Reviewed-by: Star Zeng <star.zeng@intel.com>
This change is to avoid UEFI SCT failure as UEFI SCT has no knowledge
about how to accessing a EMMC RPMB partition.
The user needs to access RPMB partition should get access through
EFI_SD_MMC_PASS_THRU protocol with authentication key & mac.
Cc: Hao Wu <hao.a.wu@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Feng Tian <feng.tian@intel.com>
Reviewed-by: Hao Wu <hao.a.wu@intel.com>
We have to upgrade the TPL level used by SdMmc stack because the
following flow:
DiskIo2ReadWriteDisk() in logical partition -> PartitionReadBlocksEx()
in logical partition at TPL callback level -> ProbeMediaStatusEx()
with sync request -> DiskIo2ReadWriteDisk() in physical partition ->
waiting for async task completion.
if the low layer driver doesn't run at TPL_NOTIFY level, it will have
no time to trigger async task and cause system hang.
Cc: Hao Wu <hao.a.wu@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Feng Tian <feng.tian@intel.com>
Reviewed-by: Hao Wu <hao.a.wu@intel.com>
It is the follow up of 3ab41b7a32
to replace UnicodeStrToAsciiStr/AsciiStrToUnicodeStr with
UnicodeStrToAsciiStrS/AsciiStrToUnicodeStrS.
Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Liming Gao <liming.gao@intel.com>
Cc: Eric Dong <eric.dong@intel.com>
Cc: Feng Tian <feng.tian@intel.com>
Cc: Ruiyu Ni <ruiyu.ni@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Star Zeng <star.zeng@intel.com>
Reviewed-by: Jaben Carsey <jaben.carsey@intel.com>
The close brace of EmmcDxeComponentNameGetControllerName should be
at the beginning of a line.
Cc: Qiu Shumin <shumin.qiu@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Feng Tian <feng.tian@intel.com>
Reviewed-by: Shumin Qiu <shumin.qiu@intel.com>
This stack includes:
1. Dxe phase support by:
1) SdMmcPciHcDxe driver to consume PciIo and produce
SdMmcPassThru.
2) SdDxe driver to consume SdMmcPassThru to produce
BlkIo1/BlkIo2.
3) EmmcDxe driver to consume SdMmcPassThru to produce
BlkIo1/BlkIo2/SSP.
2. Pei phase support
1) SdBlockIoPei driver to consume SdMmcHostController
Ppi and produce VirutalBlkIo1&2.
2) EmmcBlockIoPei driver to consume SdMmcHostController
Ppi and produce VirutalBlkIo1&2.
3) SdMmcPciHcPei driver to produce SdMmcHostController
Ppi.
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Feng Tian <feng.tian@intel.com>
Reviewed-by: Hao Wu <hao.a.wu@intel.com>
Hao Wu
Dandan Bi
Feng Tian
Star Zeng