https://bugzilla.tianocore.org/show_bug.cgi?id=1930
Updated FSP Python scripts to support both 2.x and
3.x.
Test:
. Verified with Python 2.7.12 and 3.6.6.
. Verified tool result is the same before the change.
. Both py -2 and py -3 built binary can boot.
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Nate DeSimone <nathaniel.l.desimone@intel.com>
Cc: Star Zeng <star.zeng@intel.com>
Signed-off-by: Chasel Chiu <chasel.chiu@intel.com>
Reviewed-by: Star Zeng <star.zeng@intel.com>
Reviewed-by: Nate DeSimone <nathaniel.l.desimone@intel.com>
REF: https://bugzilla.tianocore.org/show_bug.cgi?id=1308
Support rebasing FSP 1.x binary.
FSP 1.x has single component in binary so not supported
by split command and rebase can be done with the same
command for rebasing FSP-T component in FSP 2.x image.
Test: both FSP 2.x (Kabylake) and FSP 1.x (BroadwellDE) binary
can be rebased successfully.
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Nate DeSimone <nathaniel.l.desimone@intel.com>
Cc: Star Zeng <star.zeng@intel.com>
Signed-off-by: Chasel Chiu <chasel.chiu@intel.com>
Reviewed-by: Star Zeng <star.zeng@intel.com>
Reviewed-by: Nate DeSimone <nathaniel.l.desimone@intel.com>
REF: https://bugzilla.tianocore.org/show_bug.cgi?id=1308
Support rebasing FSP 1.x binary.
FSP 1.x has single component in binary so not supported
by split command and rebase can be done with the same
command for rebasing FSP-T component in FSP 2.x image.
Test: both FSP 2.x (Kabylake) and FSP 1.x (BroadwellDE) binary
can be rebased successfully.
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Nate DeSimone <nathaniel.l.desimone@intel.com>
Cc: Star Zeng <star.zeng@intel.com>
Signed-off-by: Chasel Chiu <chasel.chiu@intel.com>
Reviewed-by: Star Zeng <star.zeng@intel.com>
Reviewed-by: Nate DeSimone <nathaniel.l.desimone@intel.com>
FSP binary potentially can include X64 drivers to
simplify implementation or support new features so
update SplitFspBin.py to support x64 image headers.
Cc: Jiewen Yao <Jiewen.yao@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.1
Signed-off-by: Chasel Chiu <chasel.chiu@intel.com>
Reviewed-by: Jiewen Yao <Jiewen.yao@intel.com>
The current SplitFspBin.py can only support TE image format
rebasing in an FSP binary. This patch adds PE32 image format
rebasing support.
Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Maurice Ma <maurice.ma@intel.com>
Reviewed-by: Satya Yarlagadda <Satya.p.yarlagadda@intel.com>
Enhanced the SplitFspBin tool in IntelFsp2Pkg to support:
- Rebase FSP 2.0 components to a different base address
- Display FSP 2.0 information header
Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Maurice Ma <maurice.ma@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Add FSP2.0 support.
This series of patch is to support FSP2.0 specification at
https://firmware.intel.com/sites/default/files/FSP_EAS_v2.0_Draft%20External.pdf
Some major updates include:
1) One FSP binary is separated to multiple components:
FSP-T, FSP-M, FSP-S, and optional FSP-O.
Each component has its own configuration data region.
2) All FSP-APIs use same UPD format - FSP_UPD_HEADER.
3) Add EnumInitPhaseEndOfFirmware notifyphase.
4) FSP1.1/FSP1.0 compatibility is NOT maintained.
5) We also add rename Fsp* to FspWrapper* in IntelFsp2WrapperPkg,
to indicate that it is for FspWrapper only.
IntelFspPkg and IntelFspWrapperPkg will be deprecated.
The new Intel platform will follow FSP2.0 and use IntelFsp2Pkg
and IntelFsp2WrapperPkg.
The old platform can still use IntelFspPkg and IntelFspWrapperPkg
for compatibility consideration.
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Ravi P Rangarajan <ravi.p.rangarajan@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Jiewen Yao <jiewen.yao@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Maurice Ma <maurice.ma@intel.com>
Reviewed-by: Ravi P Rangarajan <ravi.p.rangarajan@intel.com>
Chasel Chiu
Michael D Kinney
Maurice Ma
Jiewen Yao