RFC: https://bugzilla.tianocore.org/show_bug.cgi?id=3429
There are below major changes in this commit.
1. SecEntry.nasm
In TDX BSP and APs goes to the same entry point in SecEntry.nasm.
BSP initialize the temporary stack and then jumps to SecMain, just as
legacy Ovmf does.
APs spin in a modified mailbox loop using initial mailbox structure.
Its structure defition is in OvmfPkg/Include/IndustryStandard/IntelTdx.h.
APs wait for command to see if the command is for me. If so execute the
command.
2. Sec/SecMain.c
When host VMM create the Td guest, the system memory informations are
stored in TdHob, which is a memory region described in Tdx metadata.
The system memory region in TdHob should be accepted before it can be
accessed. So the major task of this patch is to process the TdHobList
to accept the memory. After that TDVF follow the standard OVMF flow
and jump to PEI phase.
PcdUse1GPageTable is set to FALSE by default in OvmfPkgX64.dsc. It gives
no chance for Intel TDX to support 1G page table. To support 1G page
table this PCD is set to TRUE in OvmfPkgX64.dsc.
TDX_GUEST_SUPPORTED is defined in OvmfPkgX64.dsc. This macro wraps the
Tdx specific code.
TDX only works on X64, so the code is only valid in X64 arch.
Cc: Ard Biesheuvel <ardb+tianocore@kernel.org>
Cc: Jordan Justen <jordan.l.justen@intel.com>
Cc: Brijesh Singh <brijesh.singh@amd.com>
Cc: Erdem Aktas <erdemaktas@google.com>
Cc: James Bottomley <jejb@linux.ibm.com>
Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Tom Lendacky <thomas.lendacky@amd.com>
Cc: Gerd Hoffmann <kraxel@redhat.com>
Acked-by: Gerd Hoffmann <kraxel@redhat.com>
Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
Signed-off-by: Min Xu <min.m.xu@intel.com>
Original code breaks a single assembly code to multiple lines.
But, when VS CL.exe preprocesses the FixedPcdGet32() macro
invocation to the replacement text, it loses '\', and causes
NASM to fail.
Changing the multiple lines to one line to resolve the build failure.
Contributed-under: TianoCore Contribution Agreement 1.1
Signed-off-by: Ruiyu Ni <ruiyu.ni@intel.com>
Reviewed-by: Laszlo Ersek <lersek@redhat.com>
Note: The Temporary RAM memory size is being reduced from
64KB to 32KB. This still appears to be more than
adequate for OVMF's early PEI phase. We will be adding
another 32KB range of RAM just above this range for
use on S3 resume.
The range is declared as part of MEMFD, so it is easier
to identify the memory range.
We also now assign PCDs to the memory range.
The PCDs are used to set the initial SEC/PEI stack in
SEC's assembly code.
The PCDs are also used in the SEC C code to setup
the Temporary RAM PPI.
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Jordan Justen <jordan.l.justen@intel.com>
Reviewed-by: Laszlo Ersek <lersek@redhat.com>
git-svn-id: https://svn.code.sf.net/p/edk2/code/trunk/edk2@15147 6f19259b-4bc3-4df7-8a09-765794883524
Previously the interface to the SEC module was:
ESI/RSI - SEC Core entry point
EDI/RDI - PEI Core entry point
EBP/RBP - Start of BFV
Now it is:
RAX/EAX Initial value of the EAX register
(BIST: Built-in Self Test)
DI 'BP': boot-strap processor, or
'AP': application processor
RBP/EBP Address of Boot Firmware Volume (BFV)
git-svn-id: https://edk2.svn.sourceforge.net/svnroot/edk2/trunk/edk2@9572 6f19259b-4bc3-4df7-8a09-765794883524
Min Xu
Michael D Kinney
Ruiyu Ni
Laszlo Ersek
Jordan Justen
mdkinney
hhtian
jljusten
rsun3
gikidy