Commit Graph

3 Commits

Author SHA1 Message Date
Liming Gao 9095d37b8f MdePkg: Clean up source files
1. Do not use tab characters
2. No trailing white space in one line
3. All files must end with CRLF

Contributed-under: TianoCore Contribution Agreement 1.1
Signed-off-by: Liming Gao <liming.gao@intel.com>
2018-06-28 11:19:47 +08:00
Jordan Justen 1ffb3e011d MdePkg: Convert all .uni files to utf-8
To convert these files I ran:

$ python3 BaseTools/Scripts/ConvertUni.py MdePkg

Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Jordan Justen <jordan.l.justen@intel.com>
Reviewed-by: Michael Kinney <michael.d.kinney@intel.com>

git-svn-id: https://svn.code.sf.net/p/edk2/code/trunk/edk2@19256 6f19259b-4bc3-4df7-8a09-765794883524
2015-12-15 04:53:50 +00:00
Gao, Liming 8f1cbb011f MdePkg: INF/DEC file updates to EDK II packages
5. Add PACKAGE_UNI_FILE UNI file that contains the localized Abstract and Description of a package and localized strings associated with PCDs. 
a. Addresses an information gap between DEC files and the UEFI Distribution Packaging Specification XML schema
b. There will be an associated update to UPT in BaseTools to consume PACKAGE_UNI_FILE and associated UNI file during UDP creation that performs the DEC -> XML conversion.
c. There will be an associated update to UPT in BaseTools to produce PACKAGE_UNI_FILE and associated UNI file during UDP installation that performs the XML -> DEC conversion.

6. Add Package Extra UNI file that provides the localized Name of a package.
a. [UserExtensions.TianoCore."ExtraFiles"] provides an easy method for a package to specify extra files to be added to a UDP without having to list the files in the UPT package information data file.
b. There will be an associated update to UPT in BaseTools to package up files listed in [UserExtensions.TianoCore."ExtraFiles"] during UDP creation.
c. UNI file contains localized name of a package to go along with the localized Abstract and Description from the PACKAGE_UNI_FILE.

Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Gao, Liming <liming.gao@intel.com>
Reviewed-by: Michael Kinney <michael.d.kinney@intel.com>

git-svn-id: https://svn.code.sf.net/p/edk2/code/trunk/edk2@15920 6f19259b-4bc3-4df7-8a09-765794883524
2014-08-27 09:39:59 +00:00