REF: https://bugzilla.tianocore.org/show_bug.cgi?id=2698
To enhance FSP silicon initialization flexibility an optional
Multi-Phase API is introduced and FSP header needs update for
new API offset. Also new SecCore module created for
FspMultiPhaseSiInit API
New ARCH_UPD introduced for enhancing FSP debug message
flexibility now bootloader can pass its own debug handler
function pointer and FSP will call the function to handle
debug message.
To support calling bootloader functions, a FspGlobalData field
added to indicate if FSP needs to switch stack when FSP running
on separate stack from bootloader.
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Nate DeSimone <nathaniel.l.desimone@intel.com>
Cc: Star Zeng <star.zeng@intel.com>
Signed-off-by: Chasel Chiu <chasel.chiu@intel.com>
Reviewed-by: Nate DeSimone <nathaniel.l.desimone@intel.com>
1. Do not use tab characters
2. No trailing white space in one line
3. All files must end with CRLF
Contributed-under: TianoCore Contribution Agreement 1.1
Signed-off-by: Liming Gao <liming.gao@intel.com>
Add FSP2.0 support.
This series of patch is to support FSP2.0 specification at
https://firmware.intel.com/sites/default/files/FSP_EAS_v2.0_Draft%20External.pdf
Some major updates include:
1) One FSP binary is separated to multiple components:
FSP-T, FSP-M, FSP-S, and optional FSP-O.
Each component has its own configuration data region.
2) All FSP-APIs use same UPD format - FSP_UPD_HEADER.
3) Add EnumInitPhaseEndOfFirmware notifyphase.
4) FSP1.1/FSP1.0 compatibility is NOT maintained.
5) We also add rename Fsp* to FspWrapper* in IntelFsp2WrapperPkg,
to indicate that it is for FspWrapper only.
IntelFspPkg and IntelFspWrapperPkg will be deprecated.
The new Intel platform will follow FSP2.0 and use IntelFsp2Pkg
and IntelFsp2WrapperPkg.
The old platform can still use IntelFspPkg and IntelFspWrapperPkg
for compatibility consideration.
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Ravi P Rangarajan <ravi.p.rangarajan@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Jiewen Yao <jiewen.yao@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Maurice Ma <maurice.ma@intel.com>
Reviewed-by: Ravi P Rangarajan <ravi.p.rangarajan@intel.com>
Chasel Chiu
Michael D Kinney
Liming Gao
Jiewen Yao