Commit Graph

11 Commits

Author SHA1 Message Date
Loo Tung Lun 273261126e IntelFsp2Pkg: Add YAML file generation support
REF:https://bugzilla.tianocore.org/show_bug.cgi?id=3091

Add support for YAML format file generation in addition
to current BSF structure. Configuration of YAML format
output will be supported by an open source ConfigEditor.

Reference to YAML code, test and ConfigEditor is at
https://github.com/joshloo/fsp_yaml_cfg/tree/master/Tools

A unit test is also added in Tests folder. This test compares
the generated yaml file against the expected output to know
if it is constructing the yaml data structure as expected.

Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Nate DeSimone <nathaniel.l.desimone@intel.com>
Cc: Star Zeng <star.zeng@intel.com>
Cc: Chasel Chiu <chasel.chiu@intel.com>
Signed-off-by: Loo Tung Lun <tung.lun.loo@intel.com>
Reviewed-by: Chasel Chiu <chasel.chiu@intel.com>
2021-02-09 08:23:03 +00:00
Antoine Cœur 91cc60bafc IntelFsp2Pkg: Fix various typos
Fix various typos in IntelFsp2Pkg.

Signed-off-by: Cœur <coeur@gmx.fr>
Reviewed-by: Star Zeng <star.zeng@intel.com>
Reviewed-by: Chasel Chiu <chasel.chiu@intel.com>
2019-07-11 21:07:17 +08:00
Antoine Cœur efa12a3f02 Revert "FmpDevicePkg: Fix various typos"
This reverts commit f527942e6b.
Commit message was incorrect.

Signed-off-by: Cœur <coeur@gmx.fr>
Reviewed-by: Chasel Chiu <chasel.chiu@intel.com>
2019-07-11 21:07:16 +08:00
Antoine Cœur f527942e6b FmpDevicePkg: Fix various typos
Fix one typo in FmpDevicePkg.

Signed-off-by: Cœur <coeur@gmx.fr>
Reviewed-by: Star Zeng <star.zeng@intel.com>
Reviewed-by: Chasel Chiu <chasel.chiu@intel.com>
2019-07-09 21:40:00 +08:00
Chasel Chiu 8349b86836 IntelFsp2Pkg/SplitFspBin.py: Support rebasing 1.x binary.
REF: https://bugzilla.tianocore.org/show_bug.cgi?id=1308

Support rebasing FSP 1.x binary.
FSP 1.x has single component in binary so not supported
by split command and rebase can be done with the same
command for rebasing FSP-T component in FSP 2.x image.

Test: both FSP 2.x (Kabylake) and FSP 1.x (BroadwellDE) binary
      can be rebased successfully.

Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Nate DeSimone <nathaniel.l.desimone@intel.com>
Cc: Star Zeng <star.zeng@intel.com>
Signed-off-by: Chasel Chiu <chasel.chiu@intel.com>
Reviewed-by: Star Zeng <star.zeng@intel.com>
Reviewed-by: Nate DeSimone <nathaniel.l.desimone@intel.com>
2019-06-11 15:12:10 +08:00
Chasel Chiu 9d73c5608d IntelFsp2Pkg/SplitFspBin.py: Revert FSP 1.x support.
This reverts commit:
  591b8cb7f3.
Will submit again after freeze done.

Cc: Liming Gao <liming.gao@intel.com>
Signed-off-by: Chasel Chiu <chasel.chiu@intel.com>
Reviewed-by: Liming Gao <liming.gao@intel.com>
2019-05-31 15:13:28 +08:00
Chasel Chiu 591b8cb7f3 IntelFsp2Pkg/SplitFspBin.py: Support rebasing 1.x binary.
REF: https://bugzilla.tianocore.org/show_bug.cgi?id=1308

Support rebasing FSP 1.x binary.
FSP 1.x has single component in binary so not supported
by split command and rebase can be done with the same
command for rebasing FSP-T component in FSP 2.x image.

Test: both FSP 2.x (Kabylake) and FSP 1.x (BroadwellDE) binary
      can be rebased successfully.

Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Nate DeSimone <nathaniel.l.desimone@intel.com>
Cc: Star Zeng <star.zeng@intel.com>
Signed-off-by: Chasel Chiu <chasel.chiu@intel.com>
Reviewed-by: Star Zeng <star.zeng@intel.com>
Reviewed-by: Nate DeSimone <nathaniel.l.desimone@intel.com>
2019-05-31 14:02:34 +08:00
Mudusuru, Giri P 87c400e14c IntelFsp2Pkg: Converted PatchFvUserManual from .docx to .md format
Converted the the word format of the documentation into markdown format
for PatchFv.py

V2: updated the commit message descripton

Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Satya Yarlagadda <satya.p.yarlagadda@intel.com>
Cc: Satya Yarlagadda <satya.p.yarlagadda@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
2016-08-08 20:57:05 +08:00
Mudusuru, Giri P eeb71f2900 IntelFsp2Pkg: Converted GenCfgOptUserManual from .docx to .md format
Converted the the word format of the documentation into markdown format
for GenCfgOpt.py

Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Satya Yarlagadda <satya.p.yarlagadda@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
2016-08-08 20:57:04 +08:00
Jiewen Yao 0fbffbc05c InterFsp2Pkg:Tool: Add user manual for SplitFspBin tool.
Besides Split FSP binary, we added some more feature to SplitFspBin tool.
Here we add user manual for it to describe all usage.

Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Satya P Yarlagadda <satya.p.yarlagadda@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Jiewen Yao <jiewen.yao@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Maurice Ma <maurice.ma@intel.com>
2016-06-16 15:29:25 +08:00
Jiewen Yao cf1d454983 Add IntelFsp2Pkg and IntelFsp2WrapperPkg.
Add FSP2.0 support.
This series of patch is to support FSP2.0 specification at
https://firmware.intel.com/sites/default/files/FSP_EAS_v2.0_Draft%20External.pdf

Some major updates include:
1) One FSP binary is separated to multiple components:
FSP-T, FSP-M, FSP-S, and optional FSP-O.
Each component has its own configuration data region.
2) All FSP-APIs use same UPD format - FSP_UPD_HEADER.
3) Add EnumInitPhaseEndOfFirmware notifyphase.
4) FSP1.1/FSP1.0 compatibility is NOT maintained.
5) We also add rename Fsp* to FspWrapper* in IntelFsp2WrapperPkg,
to indicate that it is for FspWrapper only.

IntelFspPkg and IntelFspWrapperPkg will be deprecated.
The new Intel platform will follow FSP2.0 and use IntelFsp2Pkg
and IntelFsp2WrapperPkg.
The old platform can still use IntelFspPkg and IntelFspWrapperPkg
for compatibility consideration.

Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Ravi P Rangarajan <ravi.p.rangarajan@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Jiewen Yao <jiewen.yao@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Maurice Ma <maurice.ma@intel.com>
Reviewed-by: Ravi P Rangarajan <ravi.p.rangarajan@intel.com>
2016-05-13 13:00:53 +08:00