Commit Graph

3 Commits

Author SHA1 Message Date
Hao Wu bc8a17305d IntelFsp2Pkg DSC: Add build option to disable deprecated APIs
Add the following definition in the [BuildOptions] section in package DSC
files to disable APIs that are deprecated:

[BuildOptions]
  *_*_*_CC_FLAGS = -D DISABLE_NEW_DEPRECATED_INTERFACES

Cc: Jiewen Yao <jiewen.yao@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Hao Wu <hao.a.wu@intel.com>
Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
2016-08-08 11:00:05 +08:00
Liming Gao 970a9a8ba3 IntelFsp2Pkg: Add missing modules in Package DSC
Package DSC is used to verify the module source build.

Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Giri Mudusuru <giri.p.mudusuru@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Liming Gao <liming.gao@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
2016-07-20 13:11:32 +08:00
Jiewen Yao cf1d454983 Add IntelFsp2Pkg and IntelFsp2WrapperPkg.
Add FSP2.0 support.
This series of patch is to support FSP2.0 specification at
https://firmware.intel.com/sites/default/files/FSP_EAS_v2.0_Draft%20External.pdf

Some major updates include:
1) One FSP binary is separated to multiple components:
FSP-T, FSP-M, FSP-S, and optional FSP-O.
Each component has its own configuration data region.
2) All FSP-APIs use same UPD format - FSP_UPD_HEADER.
3) Add EnumInitPhaseEndOfFirmware notifyphase.
4) FSP1.1/FSP1.0 compatibility is NOT maintained.
5) We also add rename Fsp* to FspWrapper* in IntelFsp2WrapperPkg,
to indicate that it is for FspWrapper only.

IntelFspPkg and IntelFspWrapperPkg will be deprecated.
The new Intel platform will follow FSP2.0 and use IntelFsp2Pkg
and IntelFsp2WrapperPkg.
The old platform can still use IntelFspPkg and IntelFspWrapperPkg
for compatibility consideration.

Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Ravi P Rangarajan <ravi.p.rangarajan@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Jiewen Yao <jiewen.yao@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Maurice Ma <maurice.ma@intel.com>
Reviewed-by: Ravi P Rangarajan <ravi.p.rangarajan@intel.com>
2016-05-13 13:00:53 +08:00