3 Commits

Author	SHA1	Message	Date
Michael D Kinney	1948636048	IntelFspWrapperPkg: Replace BSD License with BSD+Patent License ... https://bugzilla.tianocore.org/show_bug.cgi?id=1373 Replace BSD 2-Clause License with BSD+Patent License. This change is based on the following emails: https://lists.01.org/pipermail/edk2-devel/2019-February/036260.html https://lists.01.org/pipermail/edk2-devel/2018-October/030385.html RFCs with detailed process for the license change: V3: https://lists.01.org/pipermail/edk2-devel/2019-March/038116.html V2: https://lists.01.org/pipermail/edk2-devel/2019-March/037669.html V1: https://lists.01.org/pipermail/edk2-devel/2019-March/037500.html Contributed-under: TianoCore Contribution Agreement 1.1 Signed-off-by: Michael D Kinney <michael.d.kinney@intel.com> Reviewed-by: Chasel Chiu <chasel.chiu@intel.com>	2019-04-09 10:58:05 -07:00
Gary Lin	b9ca25cb68	IntelFspWrapperPkg: Fix typos in comments ... - inforamtion -> information - tempory -> temporary - boundry -> boundary - immediatly -> immediately - permenent -> permanent Cc: Jiewen Yao <jiewen.yao@intel.com> Contributed-under: TianoCore Contribution Agreement 1.0 Signed-off-by: Gary Lin <glin@suse.com> Reviewed-by: Jiewen Yao <jiewen.yao@intel.com> Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>	2016-10-24 09:26:30 +08:00
jyao1	a33a2f6221	Add IntelFspWrapper to support boot EDKII on FSP bin. ... Contributed-under: TianoCore Contribution Agreement 1.0 Signed off by: Jiewen Yao <jiewen.yao@intel.com> Reviewed by: Ravi Rangarajan <ravi.p.rangarajan@intel.com> Reviewed by: Maurice Ma <maurice.ma@intel.com> Reviewed by: Giri Mudusuru <giri.p.mudusuru@intel.com> Reviewed by: Liming Gao <liming.gao@intel.com> git-svn-id: https://svn.code.sf.net/p/edk2/code/trunk/edk2@15676 6f19259b-4bc3-4df7-8a09-765794883524	2014-07-24 06:52:43 +00:00