The 64-bit version of the DS-5 debug script that retrieves the debug file
path from the PE/COFF image in memory assumes that the PE/COFF header is
packed, and that the debug directory entry in the optional header appears
at a fixed offset into the file. This is no longer true, now that we pad
between the file header and the PE header if the section alignment exceeds
the size of the header (which may be the case when the module contains a
vector table or small model code, which requires 2 KB or 4 KB section
alignment, respectively), to allow this padding to be emitted if the image
is subsequently converted to TE format.
So replace the fixed offset with a dereference of the appropriate header
field.
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Ard Biesheuvel <ard.biesheuvel@linaro.org>
Reported-by: Vladimir Olovyannikov <vladimir.olovyannikov@broadcom.com>
The ARM and AARCH64 linker scripts have recently been updated so that
the memory layouts of the ELF and PE/COFF versions of each module are
identical. In particular, this means that the ELF images now have a
hole before the first section rather than starting at offset 0x0, which
means we no longer have to correct for this difference when loading the
ELF image into the debugger.
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Ard Biesheuvel <ard.biesheuvel@linaro.org>
Acked-by: Leif Lindholm <leif.lindholm@linaro.org>
git-svn-id: https://svn.code.sf.net/p/edk2/code/trunk/edk2@18775 6f19259b-4bc3-4df7-8a09-765794883524
Remove the ARMGCC and ARMLINUXGCC from comments in the respective
Makefiles of ArmPlatformPkg and ArmJunoPkg. Also drop the wildly
outdated Versatile Express instructions, since they refer to ARMGCC
as well.
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Ard Biesheuvel <ard.biesheuvel@linaro.org>
Reviewed-by: Leif Lindholm <leif.lindholm@linaro.org>
git-svn-id: https://svn.code.sf.net/p/edk2/code/trunk/edk2@18209 6f19259b-4bc3-4df7-8a09-765794883524
Some ARM development platforms use ARM Trusted Firmware to boot.
ARM Trusted Firmware encapsulates UEFI into the FIP (Firmware
Image Package) binary.
This change allows to update the FIP binary after building UEFI.
Example to build UEFI for FVP Base model:
$ make -f ArmPlatformPkg/Scripts/Makefile \
EDK2_DSC=ArmPlatformPkg/ArmVExpressPkg/ArmVExpress-FVP-AArch64.dsc \
EDK2_ARCH=AARCH64 EDK2_TOOLCHAIN=GCC49 \
FIP_BIN=~/arm-trusted-firmware/build/fvp/release/fip.bin
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Olivier Martin <olivier.martin@arm.com>
Reviewed-by: Ronald Cron <Ronald.Cron@arm.com>
git-svn-id: https://svn.code.sf.net/p/edk2/code/trunk/edk2@17296 6f19259b-4bc3-4df7-8a09-765794883524
This is the Makefile for the Windows version of Eclipse (use
MingW for Unix 'emulation').
Signed-off-by: Olivier Martin <olivier.martin@arm.com>
git-svn-id: https://edk2.svn.sourceforge.net/svnroot/edk2/trunk/edk2@13886 6f19259b-4bc3-4df7-8a09-765794883524
These scripts allow to automatically load the symbols using either the
report file created by the BaseTools or using the memory regions
defined in the arguments.
This is the scripts for DS-5 prior to DS5 v5.12.
Signed-off-by: Olivier Martin <olivier.martin@arm.com>
git-svn-id: https://edk2.svn.sourceforge.net/svnroot/edk2/trunk/edk2@13874 6f19259b-4bc3-4df7-8a09-765794883524
Michael D Kinney
Ard Biesheuvel
Olivier Martin
Ronald Cron
Leif Lindholm
Harry Liebel
oliviermartin