Commit Graph

2 Commits

Author SHA1 Message Date
Maurice Ma c6ca1c011b IntelFsp2Pkg/Tools: Add FSP rebasing function into SplitFspBin tool
Enhanced the SplitFspBin tool in IntelFsp2Pkg to support:
  - Rebase FSP 2.0 components to a different base address
  - Display FSP 2.0 information header

Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Maurice Ma <maurice.ma@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
2016-06-01 17:26:11 -07:00
Jiewen Yao cf1d454983 Add IntelFsp2Pkg and IntelFsp2WrapperPkg.
Add FSP2.0 support.
This series of patch is to support FSP2.0 specification at
https://firmware.intel.com/sites/default/files/FSP_EAS_v2.0_Draft%20External.pdf

Some major updates include:
1) One FSP binary is separated to multiple components:
FSP-T, FSP-M, FSP-S, and optional FSP-O.
Each component has its own configuration data region.
2) All FSP-APIs use same UPD format - FSP_UPD_HEADER.
3) Add EnumInitPhaseEndOfFirmware notifyphase.
4) FSP1.1/FSP1.0 compatibility is NOT maintained.
5) We also add rename Fsp* to FspWrapper* in IntelFsp2WrapperPkg,
to indicate that it is for FspWrapper only.

IntelFspPkg and IntelFspWrapperPkg will be deprecated.
The new Intel platform will follow FSP2.0 and use IntelFsp2Pkg
and IntelFsp2WrapperPkg.
The old platform can still use IntelFspPkg and IntelFspWrapperPkg
for compatibility consideration.

Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Ravi P Rangarajan <ravi.p.rangarajan@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Jiewen Yao <jiewen.yao@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Maurice Ma <maurice.ma@intel.com>
Reviewed-by: Ravi P Rangarajan <ravi.p.rangarajan@intel.com>
2016-05-13 13:00:53 +08:00