Changed the GenCfgOpt.py script to insert pragma pack(1) instead of
pragma pack (push, 1) in the upd header files generated during fsp build.
This is to align with rest of the EDKII pkgs pragma pack usage.
Also, this scripts generates UnusedUpdSpace for UPD address gaps.
Currently it uses UIN16/UINT32/UINT64 for 2/4/8 bytes instead of UINT8[],
thus causing upd space waste to have Natural Alignment. Hence changed the
script to use UINT8[] for any unusedUpd fields above 1 byte.
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Satya Yarlagadda <satya.p.yarlagadda@intel.com>
Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Converted the the word format of the documentation into markdown format
for PatchFv.py
V2: updated the commit message descripton
Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Satya Yarlagadda <satya.p.yarlagadda@intel.com>
Cc: Satya Yarlagadda <satya.p.yarlagadda@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
Converted the the word format of the documentation into markdown format
for GenCfgOpt.py
Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Satya Yarlagadda <satya.p.yarlagadda@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
Besides Split FSP binary, we added some more feature to SplitFspBin tool.
Here we add user manual for it to describe all usage.
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Satya P Yarlagadda <satya.p.yarlagadda@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Jiewen Yao <jiewen.yao@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Maurice Ma <maurice.ma@intel.com>
Enhanced the SplitFspBin tool in IntelFsp2Pkg to support:
- Rebase FSP 2.0 components to a different base address
- Display FSP 2.0 information header
Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Maurice Ma <maurice.ma@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
The current GenCfgOpt tool does not generate bit fields in BSF.
This change will allow bit fields to be created in BSF for a specific
FSP UPD item. The argument for the tool is also updated to be in sync
with the old usage model in IntelFspPkg.
Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Maurice Ma <maurice.ma@intel.com>
Reviewed-by: Jiewen Yao <Jiewen.yao@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Add FSP2.0 support.
This series of patch is to support FSP2.0 specification at
https://firmware.intel.com/sites/default/files/FSP_EAS_v2.0_Draft%20External.pdf
Some major updates include:
1) One FSP binary is separated to multiple components:
FSP-T, FSP-M, FSP-S, and optional FSP-O.
Each component has its own configuration data region.
2) All FSP-APIs use same UPD format - FSP_UPD_HEADER.
3) Add EnumInitPhaseEndOfFirmware notifyphase.
4) FSP1.1/FSP1.0 compatibility is NOT maintained.
5) We also add rename Fsp* to FspWrapper* in IntelFsp2WrapperPkg,
to indicate that it is for FspWrapper only.
IntelFspPkg and IntelFspWrapperPkg will be deprecated.
The new Intel platform will follow FSP2.0 and use IntelFsp2Pkg
and IntelFsp2WrapperPkg.
The old platform can still use IntelFspPkg and IntelFspWrapperPkg
for compatibility consideration.
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Ravi P Rangarajan <ravi.p.rangarajan@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Jiewen Yao <jiewen.yao@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Maurice Ma <maurice.ma@intel.com>
Reviewed-by: Ravi P Rangarajan <ravi.p.rangarajan@intel.com>
Satya Yarlagadda
Mudusuru, Giri P
Jiewen Yao
Maurice Ma