Commit Graph

10 Commits

Author SHA1 Message Date
Ray Ni 7bf5255997 IntelFsp2WrapperPkg: Remove unneeded MdeModulePkg dependency
Signed-off-by: Ray Ni <ray.ni@intel.com>
Reviewed-by: Chasel Chiu <chasel.chiu@intel.com>
Cc: Nate DeSimone <nathaniel.l.desimone@intel.com>
Reviewed-by: Star Zeng <star.zeng@intel.com>
2019-09-05 02:10:03 +08:00
Michael D Kinney 512e23a333 IntelFsp2WrapperPkg: Replace BSD License with BSD+Patent License
https://bugzilla.tianocore.org/show_bug.cgi?id=1373

Replace BSD 2-Clause License with BSD+Patent License.  This change is
based on the following emails:

  https://lists.01.org/pipermail/edk2-devel/2019-February/036260.html
  https://lists.01.org/pipermail/edk2-devel/2018-October/030385.html

RFCs with detailed process for the license change:

  V3: https://lists.01.org/pipermail/edk2-devel/2019-March/038116.html
  V2: https://lists.01.org/pipermail/edk2-devel/2019-March/037669.html
  V1: https://lists.01.org/pipermail/edk2-devel/2019-March/037500.html

Contributed-under: TianoCore Contribution Agreement 1.1
Signed-off-by: Michael D Kinney <michael.d.kinney@intel.com>
Reviewed-by: Chasel Chiu <chasel.chiu@intel.com>
2019-04-09 10:58:03 -07:00
Chasel, Chiu 2098de6279 IntelFsp2WrapperPkg: Fix line ending format issue
REF: https://bugzilla.tianocore.org/show_bug.cgi?id=1352

Fixed line ending format wrong issues on some files.

Test: Verified building successfully.

Cc: Jiewen Yao <Jiewen.yao@intel.com>
Cc: Desimone Nathaniel L <nathaniel.l.desimone@intel.com>
Cc: Wu Hao A <hao.a.wu@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.1
Signed-off-by: Chasel Chiu <chasel.chiu@intel.com>
Reviewed-by: Star Zeng <star.zeng@intel.com>
Reviewed-by: Hao Wu <hao.a.wu@intel.com>
2018-11-26 11:40:27 +08:00
Chasel, Chiu 115336ccaf IntelFsp2WrapperPkg: Support FSP Dispatch mode
REF: https://bugzilla.tianocore.org/show_bug.cgi?id=1300

Provides PCD selection for FSP Wrapper to support Dispatch
mode. Also PcdFspmBaseAddress should support Dynamic for
recovery scenario (multiple FSP-M binary in flash)

Test: Verified on internal platform and both API and
      DISPATCH modes booted successfully.

Cc: Jiewen Yao <Jiewen.yao@intel.com>
Cc: Desimone Nathaniel L <nathaniel.l.desimone@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.1
Signed-off-by: Chasel Chiu <chasel.chiu@intel.com>
Reviewed-by: Jiewen Yao <Jiewen.yao@intel.com>
2018-11-20 12:03:52 +08:00
Chasel, Chiu de1e1195b3 IntelFsp2WrapperPkg: Revert 90c5bc08
Commit message issue and reverted commit
90c5bc081d.

Will re-submit with correct formats.

Cc: Jiewen Yao <Jiewen.yao@intel.com>
Cc: Star Zeng <star.zeng@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.1
Signed-off-by: Chasel Chiu <chasel.chiu@intel.com>
Reviewed-by: Star Zeng <star.zeng@intel.com>
2018-11-20 11:55:24 +08:00
Chasel, Chiu 90c5bc081d IntelFsp2WrapperPkg: Support FSP Dispatch mode
REF: https://bugzilla.tianocore.org/show_bug.cgi?id=1300

Provides PCD selection for FSP Wrapper to support Dispatch
mode. Also PcdFspmBaseAddress should support Dynamic for
recovery scenario (multiple FSP-M binary in flash)

Test: Verified on internal platform and both API and
      DISPATCH modes booted successfully.

Cc: Jiewen Yao <Jiewen.yao@intel.com>
Cc: Desimone Nathaniel L <nathaniel.l.desimone@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.1
Signed-off-by: Chasel Chiu <chasel.chiu@intel.com>
2018-11-20 11:33:14 +08:00
Chasel, Chiu e69dcef54e IntelFsp2WrapperPkg: Support UPD allocation outside FspWrapper
UPD allocation and patching can be done outside FspWrapper
as implementation choice so adding a PCD to select between
original FspWrapper allocation model or outside model

Cc: Jiewen Yao <Jiewen.yao@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Chasel Chiu <chasel.chiu@intel.com>
Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
2017-11-29 15:52:25 +08:00
Liming Gao cada0f30e6 IntelFsp2WrapperPkg: Update Protocol/Guid usage in INF files
Contributed-under: TianoCore Contribution Agreement 1.1
Signed-off-by: Liming Gao <liming.gao@intel.com>
Cc: Jiewen Yao <jiewen.yao@intel.com>
Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
2017-10-10 18:10:24 +08:00
Jiewen Yao 6f6bf5c772 IntelFsp2WrapperPkg: Update gFspWrapperTokenSpaceGuid to gIntelFsp2WrapperTokenSpaceGuid.
We updated gIntelFspPkgTokenSpaceGuid to gIntelFsp2PkgTokenSpaceGuid
in IntelFsp2Pkg, but we miss the update in IntelFsp2WrapperPkg.
This patch fixed the issue and made them consistent.

Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Cc: Satya P Yarlagadda <satya.p.yarlagadda@intel.com>
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Ravi P Rangarajan <ravi.p.rangarajan@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Jiewen Yao <jiewen.yao@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
2016-05-23 09:27:29 +08:00
Jiewen Yao cf1d454983 Add IntelFsp2Pkg and IntelFsp2WrapperPkg.
Add FSP2.0 support.
This series of patch is to support FSP2.0 specification at
https://firmware.intel.com/sites/default/files/FSP_EAS_v2.0_Draft%20External.pdf

Some major updates include:
1) One FSP binary is separated to multiple components:
FSP-T, FSP-M, FSP-S, and optional FSP-O.
Each component has its own configuration data region.
2) All FSP-APIs use same UPD format - FSP_UPD_HEADER.
3) Add EnumInitPhaseEndOfFirmware notifyphase.
4) FSP1.1/FSP1.0 compatibility is NOT maintained.
5) We also add rename Fsp* to FspWrapper* in IntelFsp2WrapperPkg,
to indicate that it is for FspWrapper only.

IntelFspPkg and IntelFspWrapperPkg will be deprecated.
The new Intel platform will follow FSP2.0 and use IntelFsp2Pkg
and IntelFsp2WrapperPkg.
The old platform can still use IntelFspPkg and IntelFspWrapperPkg
for compatibility consideration.

Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Ravi P Rangarajan <ravi.p.rangarajan@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Jiewen Yao <jiewen.yao@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Maurice Ma <maurice.ma@intel.com>
Reviewed-by: Ravi P Rangarajan <ravi.p.rangarajan@intel.com>
2016-05-13 13:00:53 +08:00