Commit Graph

7 Commits

Author SHA1 Message Date
Chasel Chiu af98f1fb03 IntelFsp2Pkg: TempRamInit API should preserve EBX/RBX register.
REF: https://bugzilla.tianocore.org/show_bug.cgi?id=4395

FSP specification defines the TempRamInit API preserved register list
which including EBX/RBX, however current implementation unexpectedly
overriding EBX/RBX register that should be fixed.

Cc: Nate DeSimone <nathaniel.l.desimone@intel.com>
Cc: Star Zeng <star.zeng@intel.com>
Signed-off-by: Chasel Chiu <chasel.chiu@intel.com>
Reviewed-by: Nate DeSimone <nathaniel.l.desimone@intel.com>
2023-04-04 16:39:41 +00:00
Kuo, Ted 3182843f3b IntelFsp2Pkg: Improvement of supporting null UPD pointer in FSP-T
REF:https://bugzilla.tianocore.org/show_bug.cgi?id=4114

1.Use xmm5 slot 1 and xmm6 slot 3 to save ucode status and UPD pointer
  respectively in TempRamInitApi in IA32 FspSecCoreT.
2.Correct inappropriate description in the return value of
  AsmGetFspInfoHeader.
3.Replace hardcoded offset value 0x1C with FSP_HEADER_IMGBASE_OFFSET in
  FspHeler.nasm.

Cc: Chasel Chiu <chasel.chiu@intel.com>
Cc: Nate DeSimone <nathaniel.l.desimone@intel.com>
Cc: Star Zeng <star.zeng@intel.com>
Cc: Ashraf Ali S <ashraf.ali.s@intel.com>
Cc: Chinni B Duggapu <chinni.b.duggapu@intel.com>
Signed-off-by: Ted Kuo <ted.kuo@intel.com>
Reviewed-by: Chasel Chiu <chasel.chiu@intel.com>
Reviewed-by: Nate DeSimone <nathaniel.l.desimone@intel.com>
2022-11-11 04:46:39 +00:00
Antoine Cœur 91cc60bafc IntelFsp2Pkg: Fix various typos
Fix various typos in IntelFsp2Pkg.

Signed-off-by: Cœur <coeur@gmx.fr>
Reviewed-by: Star Zeng <star.zeng@intel.com>
Reviewed-by: Chasel Chiu <chasel.chiu@intel.com>
2019-07-11 21:07:17 +08:00
Antoine Cœur efa12a3f02 Revert "FmpDevicePkg: Fix various typos"
This reverts commit f527942e6b.
Commit message was incorrect.

Signed-off-by: Cœur <coeur@gmx.fr>
Reviewed-by: Chasel Chiu <chasel.chiu@intel.com>
2019-07-11 21:07:16 +08:00
Antoine Cœur f527942e6b FmpDevicePkg: Fix various typos
Fix one typo in FmpDevicePkg.

Signed-off-by: Cœur <coeur@gmx.fr>
Reviewed-by: Star Zeng <star.zeng@intel.com>
Reviewed-by: Chasel Chiu <chasel.chiu@intel.com>
2019-07-09 21:40:00 +08:00
Michael D Kinney 9672cd3056 IntelFsp2Pkg: Replace BSD License with BSD+Patent License
https://bugzilla.tianocore.org/show_bug.cgi?id=1373

Replace BSD 2-Clause License with BSD+Patent License.  This change is
based on the following emails:

  https://lists.01.org/pipermail/edk2-devel/2019-February/036260.html
  https://lists.01.org/pipermail/edk2-devel/2018-October/030385.html

RFCs with detailed process for the license change:

  V3: https://lists.01.org/pipermail/edk2-devel/2019-March/038116.html
  V2: https://lists.01.org/pipermail/edk2-devel/2019-March/037669.html
  V1: https://lists.01.org/pipermail/edk2-devel/2019-March/037500.html

Contributed-under: TianoCore Contribution Agreement 1.1
Signed-off-by: Michael D Kinney <michael.d.kinney@intel.com>
Reviewed-by: Chasel Chiu <chasel.chiu@intel.com>
2019-04-09 10:58:03 -07:00
Jiewen Yao cf1d454983 Add IntelFsp2Pkg and IntelFsp2WrapperPkg.
Add FSP2.0 support.
This series of patch is to support FSP2.0 specification at
https://firmware.intel.com/sites/default/files/FSP_EAS_v2.0_Draft%20External.pdf

Some major updates include:
1) One FSP binary is separated to multiple components:
FSP-T, FSP-M, FSP-S, and optional FSP-O.
Each component has its own configuration data region.
2) All FSP-APIs use same UPD format - FSP_UPD_HEADER.
3) Add EnumInitPhaseEndOfFirmware notifyphase.
4) FSP1.1/FSP1.0 compatibility is NOT maintained.
5) We also add rename Fsp* to FspWrapper* in IntelFsp2WrapperPkg,
to indicate that it is for FspWrapper only.

IntelFspPkg and IntelFspWrapperPkg will be deprecated.
The new Intel platform will follow FSP2.0 and use IntelFsp2Pkg
and IntelFsp2WrapperPkg.
The old platform can still use IntelFspPkg and IntelFspWrapperPkg
for compatibility consideration.

Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Ravi P Rangarajan <ravi.p.rangarajan@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Jiewen Yao <jiewen.yao@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Maurice Ma <maurice.ma@intel.com>
Reviewed-by: Ravi P Rangarajan <ravi.p.rangarajan@intel.com>
2016-05-13 13:00:53 +08:00