There may be no environment variable PACKAGES_PATH defined
in flat tree, then 41d739e breaks flat tree build.
This patch is to update GenCfgOpt.py to be compatible with
both flat tree and package path build.
Cc: Richard Thomaiyar <richard.marian.thomaiyar@intel.com>
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Star Zeng <star.zeng@intel.com>
Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
Reviewed-by: Richard Thomaiyar <richard.marian.thomaiyar@intel.com>
Tested-by: Richard Thomaiyar <richard.marian.thomaiyar@intel.com>
Add PACKAGES_PATH support in GenCfgOpt.py
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Richard Thomaiyar <richard.marian.thomaiyar@intel.com>
Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Use FspSiliconInitDone2 API in Notify Phase
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Richard Thomaiyar <richard.marian.thomaiyar@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
Added FspMemoryInitDone2, FspTempRamExitDone2, FspSiliconInitDone2
to return error status to Boot Loader for FSP API calls.
To maintain backward compatibility existing functions
(FspMemoryInitDone, FspTempRamExitDone, FspSiliconInitDone)
declaration left untouched.
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Richard Thomaiyar <richard.marian.thomaiyar@intel.com>
Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
FSP Base address is part of FSP_INFO_HEADER and we don't need additional
table to report the base address of FSP components. we expect Boot
loaders to parse the FSP INFO Header to get the base address. Also, this
the FSP_DATA_TABLE is not defined in the FSP EAS and we don't see a need
for it.
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Satya Yarlagadda <satya.p.yarlagadda@intel.com>
Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
IntelFsp2Pkg:
1.Defined performance measure mask to mask the Perf id (Bits 63:56) of the
Perf Data from FSP Global data.
2.Replaced the hard coded perf ids to use the standard defines
from FspStatuscode.h
3.Add the PerfData form Fsp Global data ( for TempRaminit entry,
TempramInit exit, memoryinit entry) to FPDT entries
IntelFsp2WrapperPkg:
Moved the code to add the FSP FPDT records and wrapper FPDT records
from ReadytoBoot event to EndofFirmware event
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Satya Yarlagadda <satya.p.yarlagadda@intel.com>
Reviewed-by: Maurice Ma <maurice.ma@intel.com>
Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
The current AsmGetFspInfoHeader function in FspHeader.nasm is
position dependent code since it uses absolute address. Change
to use relative address instead to make it position independent.
Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Maurice Ma <maurice.ma@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
The current SplitFspBin.py can only support TE image format
rebasing in an FSP binary. This patch adds PE32 image format
rebasing support.
Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Maurice Ma <maurice.ma@intel.com>
Reviewed-by: Satya Yarlagadda <Satya.p.yarlagadda@intel.com>
Changed the GenCfgOpt.py script to insert pragma pack(1) instead of
pragma pack (push, 1) in the upd header files generated during fsp build.
This is to align with rest of the EDKII pkgs pragma pack usage.
Also, this scripts generates UnusedUpdSpace for UPD address gaps.
Currently it uses UIN16/UINT32/UINT64 for 2/4/8 bytes instead of UINT8[],
thus causing upd space waste to have Natural Alignment. Hence changed the
script to use UINT8[] for any unusedUpd fields above 1 byte.
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Satya Yarlagadda <satya.p.yarlagadda@intel.com>
Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Satya Yarlagadda <satya.p.yarlagadda@intel.com>
Cc: Michael Kinney <michael.d.kinney@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
we need to locate the FSP Info Header before the stack is initialized to
access the cfg region for any UPD. Hence adding the
AsmGetFspInfoHeaderNoStack function to support it.
Note: This function is there in IntelFspPkg but got removed in IntelFsp2Pkg
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Satya Yarlagadda <satya.p.yarlagadda@intel.com>
Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Converted the the word format of the documentation into markdown format
for PatchFv.py
V2: updated the commit message descripton
Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Satya Yarlagadda <satya.p.yarlagadda@intel.com>
Cc: Satya Yarlagadda <satya.p.yarlagadda@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
Converted the the word format of the documentation into markdown format
for GenCfgOpt.py
Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Satya Yarlagadda <satya.p.yarlagadda@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
Add the following definition in the [BuildOptions] section in package DSC
files to disable APIs that are deprecated:
[BuildOptions]
*_*_*_CC_FLAGS = -D DISABLE_NEW_DEPRECATED_INTERFACES
Cc: Jiewen Yao <jiewen.yao@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Hao Wu <hao.a.wu@intel.com>
Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
Current FspEas.h file includes Uefi.h which also refers to lots of other
UEFI header files not used by FSP consumer. It caused many unnecessary
header file overhead for a bootloader that consumes FSP, such as coreboot.
This change reduces the required header file number down to 3.
Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Maurice Ma <maurice.ma@intel.com>
Reviewed by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
we need to locate the FSP Info Header by calculating offset dynamically to
handle the scenario of FSP component is being rebased to different location.
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Satya Yarlagadda <satya.p.yarlagadda@intel.com>
Reviewed-by: Maurice Ma <maurice.ma@intel.com>
Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
During asm to Nasm conversion, we missed the code to skip loading the
microcode and return success if the size is zero. Added additional check to
report error if the microcode size is not zero but less than 2 kB.
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Cc: Jiewen Yao <jiewen.yao@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Satya Yarlagadda <satya.p.yarlagadda@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
CarBase and CarSize in Fsp Global data structure are no longer needed as
Boot loader doesn't pass them to FSP even in case that BL chooses to skip calling
the FspTempRamInit API. In case of FspTempramInit is called, we can use the PCDs
to identify the CarBase and Size. Hence we remove the relevant code.
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Cc: Jiewen Yao <jiewen.yao@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Satya Yarlagadda <satya.p.yarlagadda@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
In FSP2.0, Boot loader should migrate its temp ram before
calling the tempramexit API to tear down the tempram. so, we don't need the
function to migrate the BL TempRam in the IntelFsp2Pkg.
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Cc: Jiewen Yao <jiewen.yao@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Satya Yarlagadda <satya.p.yarlagadda@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
The BaseTools/Scripts/ConvertMasmToNasm.py script was used to convert
Ia32/SecCarInit.asm to Ia32/SecCarInit.nasm
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Liming Gao <liming.gao@intel.com>
The BaseTools/Scripts/ConvertMasmToNasm.py script was used to convert
Ia32/Stack.asm to Ia32/Stack.nasm
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Liming Gao <liming.gao@intel.com>
The BaseTools/Scripts/ConvertMasmToNasm.py script was used to convert
Ia32/FspDebug.asm to Ia32/FspDebug.nasm
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Liming Gao <liming.gao@intel.com>
Added new funtion in FSPCommonLib to update the FSP API return status with
the requested return status and return the control to the boot loader.
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Cc: Jiewen Yao <jiewen.yao@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Satya Yarlagadda <satya.p.yarlagadda@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
Besides Split FSP binary, we added some more feature to SplitFspBin tool.
Here we add user manual for it to describe all usage.
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Satya P Yarlagadda <satya.p.yarlagadda@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Jiewen Yao <jiewen.yao@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Maurice Ma <maurice.ma@intel.com>
Enhanced the SplitFspBin tool in IntelFsp2Pkg to support:
- Rebase FSP 2.0 components to a different base address
- Display FSP 2.0 information header
Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Maurice Ma <maurice.ma@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Adding defines from FSP EAS v2.0 section 11.2.2 Oem Status code.
Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Maurice Ma <maurice.ma@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Jiewen Yao <Jiewen.yao@intel.com>
Reviewed-by: Maurice Ma <maurice.ma@intel.com>
The current GenCfgOpt tool does not generate bit fields in BSF.
This change will allow bit fields to be created in BSF for a specific
FSP UPD item. The argument for the tool is also updated to be in sync
with the old usage model in IntelFspPkg.
Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Maurice Ma <maurice.ma@intel.com>
Reviewed-by: Jiewen Yao <Jiewen.yao@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Add doxygen style comment for structure definition.
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Cc: Satya P Yarlagadda <satya.p.yarlagadda@intel.com>
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Ravi P Rangarajan <ravi.p.rangarajan@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Jiewen Yao <jiewen.yao@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Add FSP2.0 support.
This series of patch is to support FSP2.0 specification at
https://firmware.intel.com/sites/default/files/FSP_EAS_v2.0_Draft%20External.pdf
Some major updates include:
1) One FSP binary is separated to multiple components:
FSP-T, FSP-M, FSP-S, and optional FSP-O.
Each component has its own configuration data region.
2) All FSP-APIs use same UPD format - FSP_UPD_HEADER.
3) Add EnumInitPhaseEndOfFirmware notifyphase.
4) FSP1.1/FSP1.0 compatibility is NOT maintained.
5) We also add rename Fsp* to FspWrapper* in IntelFsp2WrapperPkg,
to indicate that it is for FspWrapper only.
IntelFspPkg and IntelFspWrapperPkg will be deprecated.
The new Intel platform will follow FSP2.0 and use IntelFsp2Pkg
and IntelFsp2WrapperPkg.
The old platform can still use IntelFspPkg and IntelFspWrapperPkg
for compatibility consideration.
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Ravi P Rangarajan <ravi.p.rangarajan@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Jiewen Yao <jiewen.yao@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Maurice Ma <maurice.ma@intel.com>
Reviewed-by: Ravi P Rangarajan <ravi.p.rangarajan@intel.com>
Zeng, Star
Thomaiyar, Richard Marian
Satya Yarlagadda
Gary Lin
Maurice Ma
Giri P Mudusuru
Hao Wu
Jiewen Yao
Liming Gao