The PCDs below are unused, so they have been removed from inf.
gIntelFsp2PkgTokenSpaceGuid.PcdTemporaryRamBase
gIntelFsp2PkgTokenSpaceGuid.PcdTemporaryRamSize
Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Chasel Chiu <chasel.chiu@intel.com>
Cc: Laszlo Ersek <lersek@redhat.com>
Contributed-under: TianoCore Contribution Agreement 1.1
Signed-off-by: shenglei <shenglei.zhang@intel.com>
Reviewed-by: Chasel Chiu <chasel.chiu@intel.com>
Commit formats had issues so reverted 9 commits
from IntelFsp2Pkg and IntelFsp2WrapperPkg.
Will re-submit them with correct formats.
Cc: Jiewen Yao <Jiewen.yao@intel.com>
Cc: Star Zeng <star.zeng@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.1
Signed-off-by: Chasel Chiu <chasel.chiu@intel.com>
Reviewed-by: Star Zeng <star.zeng@intel.com>
Remove PCDs
The PCDs below are unused, so they have been removed from inf.
gIntelFsp2PkgTokenSpaceGuid.PcdTemporaryRamBase
gIntelFsp2PkgTokenSpaceGuid.PcdTemporaryRamSize
Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Chasel Chiu <chasel.chiu@intel.com>
Cc: Laszlo Ersek <lersek@redhat.com>
Contributed-under: TianoCore Contribution Agreement 1.1
Signed-off-by: shenglei <shenglei.zhang@intel.com>
Reviewed-by: Chasel Chiu <chasel.chiu@intel.com>
Add FSP2.0 support.
This series of patch is to support FSP2.0 specification at
https://firmware.intel.com/sites/default/files/FSP_EAS_v2.0_Draft%20External.pdf
Some major updates include:
1) One FSP binary is separated to multiple components:
FSP-T, FSP-M, FSP-S, and optional FSP-O.
Each component has its own configuration data region.
2) All FSP-APIs use same UPD format - FSP_UPD_HEADER.
3) Add EnumInitPhaseEndOfFirmware notifyphase.
4) FSP1.1/FSP1.0 compatibility is NOT maintained.
5) We also add rename Fsp* to FspWrapper* in IntelFsp2WrapperPkg,
to indicate that it is for FspWrapper only.
IntelFspPkg and IntelFspWrapperPkg will be deprecated.
The new Intel platform will follow FSP2.0 and use IntelFsp2Pkg
and IntelFsp2WrapperPkg.
The old platform can still use IntelFspPkg and IntelFspWrapperPkg
for compatibility consideration.
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Ravi P Rangarajan <ravi.p.rangarajan@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Jiewen Yao <jiewen.yao@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Maurice Ma <maurice.ma@intel.com>
Reviewed-by: Ravi P Rangarajan <ravi.p.rangarajan@intel.com>
shenglei
Chasel, Chiu
Jiewen Yao