Converted the the word format of the documentation into markdown format
for PatchFv.py
V2: updated the commit message descripton
Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Satya Yarlagadda <satya.p.yarlagadda@intel.com>
Cc: Satya Yarlagadda <satya.p.yarlagadda@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
Converted the the word format of the documentation into markdown format
for GenCfgOpt.py
Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Satya Yarlagadda <satya.p.yarlagadda@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
Add the following definition in the [BuildOptions] section in package DSC
files to disable APIs that are deprecated:
[BuildOptions]
*_*_*_CC_FLAGS = -D DISABLE_NEW_DEPRECATED_INTERFACES
Cc: Jiewen Yao <jiewen.yao@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Hao Wu <hao.a.wu@intel.com>
Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
Current FspEas.h file includes Uefi.h which also refers to lots of other
UEFI header files not used by FSP consumer. It caused many unnecessary
header file overhead for a bootloader that consumes FSP, such as coreboot.
This change reduces the required header file number down to 3.
Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Maurice Ma <maurice.ma@intel.com>
Reviewed by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
we need to locate the FSP Info Header by calculating offset dynamically to
handle the scenario of FSP component is being rebased to different location.
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Satya Yarlagadda <satya.p.yarlagadda@intel.com>
Reviewed-by: Maurice Ma <maurice.ma@intel.com>
Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
During asm to Nasm conversion, we missed the code to skip loading the
microcode and return success if the size is zero. Added additional check to
report error if the microcode size is not zero but less than 2 kB.
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Cc: Jiewen Yao <jiewen.yao@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Satya Yarlagadda <satya.p.yarlagadda@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
CarBase and CarSize in Fsp Global data structure are no longer needed as
Boot loader doesn't pass them to FSP even in case that BL chooses to skip calling
the FspTempRamInit API. In case of FspTempramInit is called, we can use the PCDs
to identify the CarBase and Size. Hence we remove the relevant code.
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Cc: Jiewen Yao <jiewen.yao@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Satya Yarlagadda <satya.p.yarlagadda@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
In FSP2.0, Boot loader should migrate its temp ram before
calling the tempramexit API to tear down the tempram. so, we don't need the
function to migrate the BL TempRam in the IntelFsp2Pkg.
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Cc: Jiewen Yao <jiewen.yao@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Satya Yarlagadda <satya.p.yarlagadda@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
The BaseTools/Scripts/ConvertMasmToNasm.py script was used to convert
Ia32/SecCarInit.asm to Ia32/SecCarInit.nasm
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Liming Gao <liming.gao@intel.com>
The BaseTools/Scripts/ConvertMasmToNasm.py script was used to convert
Ia32/Stack.asm to Ia32/Stack.nasm
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Liming Gao <liming.gao@intel.com>
The BaseTools/Scripts/ConvertMasmToNasm.py script was used to convert
Ia32/FspDebug.asm to Ia32/FspDebug.nasm
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Liming Gao <liming.gao@intel.com>
Added new funtion in FSPCommonLib to update the FSP API return status with
the requested return status and return the control to the boot loader.
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Cc: Jiewen Yao <jiewen.yao@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Satya Yarlagadda <satya.p.yarlagadda@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
Besides Split FSP binary, we added some more feature to SplitFspBin tool.
Here we add user manual for it to describe all usage.
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Satya P Yarlagadda <satya.p.yarlagadda@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Jiewen Yao <jiewen.yao@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Maurice Ma <maurice.ma@intel.com>
Enhanced the SplitFspBin tool in IntelFsp2Pkg to support:
- Rebase FSP 2.0 components to a different base address
- Display FSP 2.0 information header
Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Maurice Ma <maurice.ma@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Adding defines from FSP EAS v2.0 section 11.2.2 Oem Status code.
Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Maurice Ma <maurice.ma@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Jiewen Yao <Jiewen.yao@intel.com>
Reviewed-by: Maurice Ma <maurice.ma@intel.com>
The current GenCfgOpt tool does not generate bit fields in BSF.
This change will allow bit fields to be created in BSF for a specific
FSP UPD item. The argument for the tool is also updated to be in sync
with the old usage model in IntelFspPkg.
Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Maurice Ma <maurice.ma@intel.com>
Reviewed-by: Jiewen Yao <Jiewen.yao@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Add doxygen style comment for structure definition.
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Cc: Satya P Yarlagadda <satya.p.yarlagadda@intel.com>
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Ravi P Rangarajan <ravi.p.rangarajan@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Jiewen Yao <jiewen.yao@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Add FSP2.0 support.
This series of patch is to support FSP2.0 specification at
https://firmware.intel.com/sites/default/files/FSP_EAS_v2.0_Draft%20External.pdf
Some major updates include:
1) One FSP binary is separated to multiple components:
FSP-T, FSP-M, FSP-S, and optional FSP-O.
Each component has its own configuration data region.
2) All FSP-APIs use same UPD format - FSP_UPD_HEADER.
3) Add EnumInitPhaseEndOfFirmware notifyphase.
4) FSP1.1/FSP1.0 compatibility is NOT maintained.
5) We also add rename Fsp* to FspWrapper* in IntelFsp2WrapperPkg,
to indicate that it is for FspWrapper only.
IntelFspPkg and IntelFspWrapperPkg will be deprecated.
The new Intel platform will follow FSP2.0 and use IntelFsp2Pkg
and IntelFsp2WrapperPkg.
The old platform can still use IntelFspPkg and IntelFspWrapperPkg
for compatibility consideration.
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Ravi P Rangarajan <ravi.p.rangarajan@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Jiewen Yao <jiewen.yao@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Maurice Ma <maurice.ma@intel.com>
Reviewed-by: Ravi P Rangarajan <ravi.p.rangarajan@intel.com>
Mudusuru, Giri P
Hao Wu
Maurice Ma
Yarlagadda, Satya P
Jiewen Yao
Liming Gao