Commit Graph

3 Commits

Author SHA1 Message Date
Liming Gao e37bb20c7b IntelFsp2Pkg: Clean up source files
1. Do not use tab characters
2. No trailing white space in one line
3. All files must end with CRLF

Contributed-under: TianoCore Contribution Agreement 1.1
Signed-off-by: Liming Gao <liming.gao@intel.com>
2018-06-28 11:19:43 +08:00
Yarlagadda, Satya P 6b5677e1bb IntelFsp2Pkg-BaseFspCommonLib: Add funtion to return the reset required status
Added new funtion in FSPCommonLib to update the FSP API return status with
the requested return status and return the control to the boot loader.

Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Cc: Jiewen Yao <jiewen.yao@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Satya Yarlagadda <satya.p.yarlagadda@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
2016-06-27 11:47:48 +08:00
Jiewen Yao cf1d454983 Add IntelFsp2Pkg and IntelFsp2WrapperPkg.
Add FSP2.0 support.
This series of patch is to support FSP2.0 specification at
https://firmware.intel.com/sites/default/files/FSP_EAS_v2.0_Draft%20External.pdf

Some major updates include:
1) One FSP binary is separated to multiple components:
FSP-T, FSP-M, FSP-S, and optional FSP-O.
Each component has its own configuration data region.
2) All FSP-APIs use same UPD format - FSP_UPD_HEADER.
3) Add EnumInitPhaseEndOfFirmware notifyphase.
4) FSP1.1/FSP1.0 compatibility is NOT maintained.
5) We also add rename Fsp* to FspWrapper* in IntelFsp2WrapperPkg,
to indicate that it is for FspWrapper only.

IntelFspPkg and IntelFspWrapperPkg will be deprecated.
The new Intel platform will follow FSP2.0 and use IntelFsp2Pkg
and IntelFsp2WrapperPkg.
The old platform can still use IntelFspPkg and IntelFspWrapperPkg
for compatibility consideration.

Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Ravi P Rangarajan <ravi.p.rangarajan@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Jiewen Yao <jiewen.yao@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Maurice Ma <maurice.ma@intel.com>
Reviewed-by: Ravi P Rangarajan <ravi.p.rangarajan@intel.com>
2016-05-13 13:00:53 +08:00