mirror of https://github.com/acidanthera/audk.git
08ac799d36
According to the markdown language syntax, headings should be after number signs (#). The number of number signs correspond to the heading level. But current PatchFvUserManual.md doesn't insert a space between the number signs and the heading title, resulting the markdown file is not rendered well in markdown viewers. The patch doesn't change any content but only adds spaces to ensure the headings are correctly recognized. Signed-off-by: Ray Ni <ray.ni@intel.com> Cc: Chasel Chiu <chasel.chiu@intel.com> Reviewed-by: Nate DeSimone <nathaniel.l.desimone@intel.com> Cc: Duggapu Chinni B <chinni.b.duggapu@intel.com> Cc: Ray Han Lim Ng <ray.han.lim.ng@intel.com> Cc: Star Zeng <star.zeng@intel.com> Cc: Ted Kuo <ted.kuo@intel.com> Reviewed-by: Ashraf Ali S <ashraf.ali.s@intel.com> Cc: Susovan Mohapatra <susovan.mohapatra@intel.com> |
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| .. | ||
| FspNotifyPhase | ||
| FspSecCore | ||
| Include | ||
| Library | ||
| Tools | ||
| IntelFsp2Pkg.ci.yaml | ||
| IntelFsp2Pkg.dec | ||
| IntelFsp2Pkg.dsc | ||
| Readme.md | ||
Readme.md
IntelFsp2Pkg
This package provides the component to create an FSP binary.
Source Repository: https://github.com/tianocore/edk2/tree/master/IntelFsp2Pkg
A whitepaper to describe the IntelFsp2Pkg: https://firmware.intel.com/sites/default/files/A_Tour_Beyond_BIOS_Creating_the_Intel_Firmware_Support_Package_with_the_EFI_Developer_Kit_II_%28FSP2.0%29.pdf