The PCDs below are unused, so they have been removed from inf.
gIntelFsp2PkgTokenSpaceGuid.PcdFspMaxPatchEntry
gIntelFsp2PkgTokenSpaceGuid.PcdFspMaxPerfEntry
Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Chasel Chiu <chasel.chiu@intel.com>
Cc: Laszlo Ersek <lersek@redhat.com>
Contributed-under: TianoCore Contribution Agreement 1.1
Signed-off-by: shenglei <shenglei.zhang@intel.com>
Reviewed-by: Chasel Chiu <chasel.chiu@intel.com>
The PCDs below are unused, so they have been removed from inf.
gIntelFsp2PkgTokenSpaceGuid.PcdFspMaxPatchEntry
gIntelFsp2PkgTokenSpaceGuid.PcdFspMaxPerfEntry
gIntelFsp2PkgTokenSpaceGuid.PcdTemporaryRamBase
gIntelFsp2PkgTokenSpaceGuid.PcdTemporaryRamSize
Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Chasel Chiu <chasel.chiu@intel.com>
Cc: Laszlo Ersek <lersek@redhat.com>
Contributed-under: TianoCore Contribution Agreement 1.1
Signed-off-by: shenglei <shenglei.zhang@intel.com>
Reviewed-by: Chasel Chiu <chasel.chiu@intel.com>
Commit formats had issues so reverted 9 commits
from IntelFsp2Pkg and IntelFsp2WrapperPkg.
Will re-submit them with correct formats.
Cc: Jiewen Yao <Jiewen.yao@intel.com>
Cc: Star Zeng <star.zeng@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.1
Signed-off-by: Chasel Chiu <chasel.chiu@intel.com>
Reviewed-by: Star Zeng <star.zeng@intel.com>
PCDs
The PCDs below are unused, so they have been removed from inf.
gIntelFsp2PkgTokenSpaceGuid.PcdFspMaxPatchEntry
gIntelFsp2PkgTokenSpaceGuid.PcdFspMaxPerfEntry
Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Chasel Chiu <chasel.chiu@intel.com>
Cc: Laszlo Ersek <lersek@redhat.com>
Contributed-under: TianoCore Contribution Agreement 1.1
Signed-off-by: shenglei <shenglei.zhang@intel.com>
Reviewed-by: Chasel Chiu <chasel.chiu@intel.com>
The PCDs below are unused, so they have been removed from inf.
gIntelFsp2PkgTokenSpaceGuid.PcdFspMaxPatchEntry
gIntelFsp2PkgTokenSpaceGuid.PcdFspMaxPerfEntry
gIntelFsp2PkgTokenSpaceGuid.PcdTemporaryRamBase
gIntelFsp2PkgTokenSpaceGuid.PcdTemporaryRamSize
Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Chasel Chiu <chasel.chiu@intel.com>
Cc: Laszlo Ersek <lersek@redhat.com>
Contributed-under: TianoCore Contribution Agreement 1.1
Signed-off-by: shenglei <shenglei.zhang@intel.com>
Reviewed-by: Chasel Chiu <chasel.chiu@intel.com>
1. Do not use tab characters
2. No trailing white space in one line
3. All files must end with CRLF
Contributed-under: TianoCore Contribution Agreement 1.1
Signed-off-by: Liming Gao <liming.gao@intel.com>
Added FspMemoryInitDone2, FspTempRamExitDone2, FspSiliconInitDone2
to return error status to Boot Loader for FSP API calls.
To maintain backward compatibility existing functions
(FspMemoryInitDone, FspTempRamExitDone, FspSiliconInitDone)
declaration left untouched.
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Richard Thomaiyar <richard.marian.thomaiyar@intel.com>
Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
FSP Base address is part of FSP_INFO_HEADER and we don't need additional
table to report the base address of FSP components. we expect Boot
loaders to parse the FSP INFO Header to get the base address. Also, this
the FSP_DATA_TABLE is not defined in the FSP EAS and we don't see a need
for it.
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Satya Yarlagadda <satya.p.yarlagadda@intel.com>
Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
IntelFsp2Pkg:
1.Defined performance measure mask to mask the Perf id (Bits 63:56) of the
Perf Data from FSP Global data.
2.Replaced the hard coded perf ids to use the standard defines
from FspStatuscode.h
3.Add the PerfData form Fsp Global data ( for TempRaminit entry,
TempramInit exit, memoryinit entry) to FPDT entries
IntelFsp2WrapperPkg:
Moved the code to add the FSP FPDT records and wrapper FPDT records
from ReadytoBoot event to EndofFirmware event
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Satya Yarlagadda <satya.p.yarlagadda@intel.com>
Reviewed-by: Maurice Ma <maurice.ma@intel.com>
Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Satya Yarlagadda <satya.p.yarlagadda@intel.com>
Cc: Michael Kinney <michael.d.kinney@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
CarBase and CarSize in Fsp Global data structure are no longer needed as
Boot loader doesn't pass them to FSP even in case that BL chooses to skip calling
the FspTempRamInit API. In case of FspTempramInit is called, we can use the PCDs
to identify the CarBase and Size. Hence we remove the relevant code.
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Cc: Jiewen Yao <jiewen.yao@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Satya Yarlagadda <satya.p.yarlagadda@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
In FSP2.0, Boot loader should migrate its temp ram before
calling the tempramexit API to tear down the tempram. so, we don't need the
function to migrate the BL TempRam in the IntelFsp2Pkg.
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Cc: Jiewen Yao <jiewen.yao@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Satya Yarlagadda <satya.p.yarlagadda@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
The BaseTools/Scripts/ConvertMasmToNasm.py script was used to convert
Ia32/SecCarInit.asm to Ia32/SecCarInit.nasm
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Liming Gao <liming.gao@intel.com>
The BaseTools/Scripts/ConvertMasmToNasm.py script was used to convert
Ia32/Stack.asm to Ia32/Stack.nasm
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Liming Gao <liming.gao@intel.com>
The BaseTools/Scripts/ConvertMasmToNasm.py script was used to convert
Ia32/FspDebug.asm to Ia32/FspDebug.nasm
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Liming Gao <liming.gao@intel.com>
Added new funtion in FSPCommonLib to update the FSP API return status with
the requested return status and return the control to the boot loader.
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Cc: Jiewen Yao <jiewen.yao@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Satya Yarlagadda <satya.p.yarlagadda@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
Add FSP2.0 support.
This series of patch is to support FSP2.0 specification at
https://firmware.intel.com/sites/default/files/FSP_EAS_v2.0_Draft%20External.pdf
Some major updates include:
1) One FSP binary is separated to multiple components:
FSP-T, FSP-M, FSP-S, and optional FSP-O.
Each component has its own configuration data region.
2) All FSP-APIs use same UPD format - FSP_UPD_HEADER.
3) Add EnumInitPhaseEndOfFirmware notifyphase.
4) FSP1.1/FSP1.0 compatibility is NOT maintained.
5) We also add rename Fsp* to FspWrapper* in IntelFsp2WrapperPkg,
to indicate that it is for FspWrapper only.
IntelFspPkg and IntelFspWrapperPkg will be deprecated.
The new Intel platform will follow FSP2.0 and use IntelFsp2Pkg
and IntelFsp2WrapperPkg.
The old platform can still use IntelFspPkg and IntelFspWrapperPkg
for compatibility consideration.
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Ravi P Rangarajan <ravi.p.rangarajan@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Jiewen Yao <jiewen.yao@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Maurice Ma <maurice.ma@intel.com>
Reviewed-by: Ravi P Rangarajan <ravi.p.rangarajan@intel.com>
shenglei
Chasel, Chiu
Liming Gao
Thomaiyar, Richard Marian
Satya Yarlagadda
Giri P Mudusuru
Jiewen Yao