Adding Intel Firmware Version Info (FVI) related defines & structures.
FVI enables reporting the Firmware Versions using SMBIOS OEM Type.
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
Reviewed-by: Star Zeng <star.zeng@intel.com>
Updated IgdOpregion.h to align with latest specification
https://01.org/sites/default/files/documentation/skl_opregion_rev0p5.pdf
1) Updated Mailbox structures to align with latest spec
2) Added Mailbox 5 structure
3) Added defines for Signature and Mailbox support
Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
Reviewed-by: Maurice Ma <maurice.ma@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Renamed INTEL_IGD_* to IGD_* and IGD_OPREGION_VBT to IGD_OPREGION_MBOX4
to make it consistent with file name and other mailbox naming.
Cc: Jiewen Yao <jiewen.yao@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
1) Fixed the VBT size from 0x1C00(7KB) to 0x1800(6KB) and typos, indentation
2) Updated offsets in hex values and offset from start of OPREGION
Cc: Jiewen Yao <jiewen.yao@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
OpRegion.
Add IGD OpRegion definition from Intel Integrated Graphics Device OpRegion
Specification.
at https://01.org/sites/default/files/documentation/acpi_igd_opregion_spec_0.pdf
Previous submission seems appears to be cut off. I do not know why.
Add missing part here.
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Jiewen Yao <jiewen.yao@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
This package will include open source common Intel silicon related modules.
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Jiewen Yao <jiewen.yao@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>